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Content Overview
The PA series industrial process online analyzers are designed for the monitoring and control of critical chemical components' concentrations in wet chemical processes within the electronics and semiconductor industries. These processes include, but are not limited to, acid etching, developing, etching, film removal, brown oxidation, desmear, copper plating, and tin plating.
The analyzer operates on a versatile hardware platform and is supported by software with process editing capabilities. This allows for customization based on the specific detection projects and methods required by the user.
Example Configuration for Common Control Projects in the PCB Industry:
Process | Tank | Test Items | Testing Method | Configuration |
Acid Etching | Acid Etching | Sulfuric Acid（H2SO4） | Acid-Base Titration | |
Developing | Developing | Sodium Carbonate（Na2CO3） | Acid-Base Titration | |
DES | Development | Sodium Carbonate（Na2CO3） | Acid-Base Titration | |
Etching | Acidity | Acid-Base Titration | ||
Copper（Cu2+） | Complexometric Titration / Photometer | |||
Film Removal | Sodium Hydroxide（NaOH） | Acid-Base Titration | ||
Etching | Acid Etching | Sulfuric Acid（H2SO4） | Acid-Base Titration | |
Rapid Etching | Sulfuric Acid（H2SO4） | Acid-Base Titration | ||
Copper（Cu2+） | Complexometric Titration / Photometer | |||
Hydrogen Peroxide（H2O2） | Redox Potential Titration | |||
Brown Oxidation | Acid Etching | Sulfuric Acid（H2SO4） | Acid-Base Titration | |
Copper（Cu2+） | Complexometric Titration / Photometer | |||
Sodium Persulfate（Na2S2O8） | Redox Potential Titration | |||
Degreasing | Degreaser | Acid-Base Titration | ||
Brown Oxidation | Brown Oxidation Reagent | Photometer | ||
Sulfuric Acid（H2SO4） | Acid-Base Titration | |||
Copper（Cu2+） | Complexometric Titration / Photometer | |||
Hydrogen Peroxide（H2O2） | Redox Potential Titration | |||
Desmear | Swelling | Sodium Carbonate | Acid-Base Titration | |
Sodium Hydroxide | Acid-Base Titration | |||
Desmear | Hexavalent Manganese（Mn6+） Heptavalent manganese（Mn7+） | Photometer | ||
Sodium Carbonate | Acid-Base Titration | |||
Sodium Hydroxide | Acid-Base Titration | |||
Neutralization | Acidity | Acid-Base Titration | ||
Neutralizer | Redox Potential Titration | |||
Acid Dip | Sulfuric Acid（H2SO4） | Acid-Base Titration | ||
PTH | Microetching | Sulfuric Acid（H2SO4） | Acid-Base Titration | |
Copper（Cu2+） | Complexometric Titration / Photometer | |||
Hydrogen Peroxide（H2O2） | Redox Potential Titration | |||
Acid Etching | Sulfuric Acid（H2SO4） | Acid-Base Titration | ||
Pre-Dip | Sulfuric Acid（H2SO4） | Acid-Base Titration | ||
Copper（Cu2+） | Photometer | |||
Activation | pH | Electrode | ||
Palladium（Pd2+） | Photometer | |||
Reduction | pH | Electrode | ||
Reductant | Redox Potential Titration | |||
Chemical Copper Plating | Formaldehyde（HCHO） Sodium Hydroxide（NaOH） | Acid-Base Titration | ||
Basic Reagent | Redox Potential Titration / Photometer | |||
Additive | Redox Potential Titration / Photometer | |||
Copper Plating | Degreasing | Acidity | Acid-Base Titration | |
Acid Etching | Sulfuric Acid（H2SO4） | Acid-Base Titration | ||
Copper Plating | Sulfuric Acid（H2SO4） | Acid-Base Titration | ||
Chloride（Cl-） | Precipitation Titration | |||
Copper Sulfate Pentahydrate（CuSO4·5H2O） | Complexometric Titration / Photometer | |||
Stripping | Sulfuric Acid（H2SO4） | Acid-Base Titration | ||
Copper（Cu2+） | Complexometric Titration / Photometer | |||
Hydrogen Peroxide（H2O2） | Redox Potential Titration | |||
Acid Etching | Sulfuric Acid（H2SO4） | Acid-Base Titration | ||
Copper Plating | Copper Plating | Copper Sulfate Pentahydrate（CuSO4·5H2O） | Photometer | |
Chemical Tin Plating | Degreasing | Degreaser | Acid-Base Titration | |
Microetching | Microetchant | Redox Potential Titration | ||
Copper（Cu2+） | Complexometric Titration / Photometer | |||
Chemical Tin Plating | Acidity | Acid-Base Titration | ||
Thiourea | Photometer | |||
Divalent Tin（Sn2+） | Photometric Titration | |||
Copper（Cu2+） | Photometer | |||
Alkaline Cleaning | pH | Electrode | ||
Deionization | Post-Soaking Agent | Acid-Base Titration |
The PA series industrial process online analyzers are designed for the monitoring and control of critical chemical components' concentrations in wet chemical processes within the electronics and semiconductor industries. These processes include, but are not limited to, acid etching, developing, etching, film removal, brown oxidation, desmear, copper plating, and tin plating.
The analyzer operates on a versatile hardware platform and is supported by software with process editing capabilities. This allows for customization based on the specific detection projects and methods required by the user.
Example Configuration for Common Control Projects in the PCB Industry:
Process | Test Items |
Acid Etching | Sulfuric Acid（H2SO4） |
Developing | Sodium Carbonate（Na2CO3） |
DES | Sodium Carbonate（Na2CO3） |
Acidity | |
Copper（Cu2+） | |
Sodium Hydroxide（NaOH） | |
Etching | Sulfuric Acid（H2SO4） |
Sulfuric Acid（H2SO4） | |
Copper（Cu2+） | |
Hydrogen Peroxide（H2O2） | |
Brown Oxidation | Sulfuric Acid（H2SO4） |
Copper（Cu2+） | |
Sodium Persulfate（Na2S2O8） | |
Degreaser | |
Brown Oxidation Reagent | |
Sulfuric Acid（H2SO4） | |
Copper（Cu2+） | |
Hydrogen Peroxide（H2O2） | |
Desmear | Sodium Carbonate |
Sodium Hydroxide | |
Hexavalent Manganese（Mn6+） Heptavalent manganese（Mn7+） | |
Sodium Carbonate | |
Sodium Hydroxide | |
Acidity | |
Neutralizer | |
Sulfuric Acid（H2SO4） | |
PTH | Sulfuric Acid（H2SO4） |
Copper（Cu2+） | |
Hydrogen Peroxide（H2O2） | |
Sulfuric Acid（H2SO4） | |
Sulfuric Acid（H2SO4） | |
Copper（Cu2+） | |
pH | |
Palladium（Pd2+） | |
pH | |
Reductant | |
Formaldehyde（HCHO） Sodium Hydroxide（NaOH） | |
Basic Reagent | |
Additive | |
Copper Plating | Acidity |
Sulfuric Acid（H2SO4） | |
Sulfuric Acid（H2SO4） | |
Chloride（Cl-） | |
Copper Sulfate Pentahydrate（CuSO4·5H2O） | |
Sulfuric Acid（H2SO4） | |
Copper（Cu2+） | |
Hydrogen Peroxide（H2O2） | |
Sulfuric Acid（H2SO4） | |
Copper Plating | Copper Sulfate Pentahydrate（CuSO4·5H2O） |
Chemical Tin Plating | Degreaser |
Microetchant | |
Copper（Cu2+） | |
Acidity | |
Thiourea | |
Divalent Tin（Sn2+） | |
Copper（Cu2+） | |
pH | |
Post-Soaking Agent |
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